LGA 1851,代號Socket V1,是由英特爾公司(Intel)所設計的CPU插座。此插座供2024年上市之Arrow Lake及Meteor Lake-PS微架構電腦處理器使用[1],採平面网格阵列封装(LGA)設計,針腳數1851個,較前一代LGA 1700有所增加[2]。
它提供20個PCIe 5.0通道(x16 用於擴充卡,x4 用於儲存),和另外4個PCIe 4.0通道用於儲存。與前代產品(LGA 1700)不同,LGA 1851不再支援DDR4記憶體,只支援DDR5記憶體[3][4][5][6]。
LGA 1851與LGA 1700的插槽尺吋與散熱器孔位相同,散熱器可相容,但LGA 1851的發熱點與LGA 1700相比略有偏移,因此水冷散熱器的進水與出水口方向需調整,以達到較佳的散熱效果[7]。
- ^ Intel CPU launch plans: Refreshes, Meteor Lake and Arrow Lake. June 22, 2023 [June 29, 2023]. (原始内容存档于June 29, 2023).
- ^ Norem, Josh. Intel Confirms Raptor Lake Refresh. ExtremeTech. June 23, 2023 [June 29, 2023]. (原始内容存档于June 29, 2023) (美国英语).
- ^ Klotz, Aaron. Intel's LGA 1851 Socket For 15th Gen Arrow Lake CPUs Detailed In 3D Schematics. HotHardware. September 21, 2023 [December 24, 2023]. (原始内容存档于24 December 2023) (美国英语).
- ^ Intel LGA-1851 "Arrow Lake" Socket Detailed. TechPowerUp. September 21, 2023 [December 24, 2023]. (原始内容存档于September 23, 2023) (美国英语).
- ^ Norem, Josh. Intel's Upcoming LGA 1851 Socket Details Revealed. ExtremeTech. July 18, 2023 [December 24, 2023]. (原始内容存档于December 24, 2023) (美国英语).
- ^ Intel Socket LGA1851 Only Supports DDR5 Memory. TechPowerUp. August 21, 2023 [November 26, 2023]. (原始内容存档于November 26, 2023) (美国英语).
- ^ JC. Intel Arrow Lake 處理器採用 LGA 1851 插槽,散熱熱點北移. TECHSPACE. 2024-10-03 [2024-11-11] (中文(繁體)).